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k | 8001 DIGITAL I/O and IP CARRIER BOARD | ||
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Introduction
The unit is constructed to the VME64x standard, with EMC front panel, injector/ejector handles, guide pin and slot keying, static discharge protection, hot swap capability, geographical addressing, 5-row P1 and P2 connectors and 5-row P0 connector. The 64 TTL signals plus 8 strobes then connect to the main board according to the VME64x Greenspring pin-out for IP module carriers (to maintain compatibility). The input states are latched and examined at a programmable rate up to 1MHz and stored in a RAM 64k deep per input. The input states are debounced at a programmable rate (including OFF) and changes detected. The processor is then interrupted if a change has occurred.
Additional Features
The function of the eight input/output strobes is programmable, including their use as a sample clock. There are two TTL inputs on the front panel for similar functions including history acquisition stop/start. A micro-switch in one of the handles detects insertion/removal and a hot-swap controller powers the unit smoothly up and down without disturbing the rest of the system. Host interaction during insertion/removal is in accordance with the VME64x specification. There are two IP sites on the board addressable on an individual basis which replace part of the input path (i.e. they take over 32 input lines). Addressing and handling of these IP sites is programmable through base control and status registers, including address offsets and interrupt mapping. The unit supports addressing in A16/D32/D16/D08(EO), A24/D32/D16/D08(EO) and A32/D32/D16/D08(EO) modes as well as BLT32. The registers and 'history' memory can be read at any time but BLT32 is inhibited while sampling into memory is active.
Product Specifications Power Requirements Operating Temperature Range: 0 to +45 deg
Celsius ambient
Signal Specifications Inhibit Digital Inputs/Outputs 0-63 Ordering Information |
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HYTEC VME64x Instrumentation | |||
Copyright © 2008 [Hytec Electronics Ltd]. All rights reserved. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. |